Electronic Printed Circuit Board Assembly

Click here for a list of electronic assembly equipment

APSM Systems has created a highly flexible printed circuit board assembly facility at its headquarters in Phoenix, AZ. Our highly-skilled, IPC-610 trained operators are capable of taking on low, medium and high volume projects, with a proven track record in surface mount, ball grid array (BGA) and plated through hole (PTH) technologies.

For over #DateDiff("yyyy",CreateDate(1989,1,1),Now())# years we have provided cost-competitive turnkey contract manufacturing services, including materials procurement, PCB assembly, electro-mechanical assembly, in-circuit test & full functional testing to a wide range of customers from diverse market sectors.

Auto-Insertion Machines	ICT Test	X-Ray Inspection	SMT Line

PCB Assembly Capabilities:

• Surface-mount technology (SMT)
• Ball Grid Array (BGA / micro BGA, fine pitch)
• X-Ray inspection
• Plated through hole (PTH)
• Mixed technology
• Single and double-sided (dense population)
• In-circuit test
• Conformal coating